Kenmerken:
Thermal silicone compound (grease) for heatsinks
Helps the heat dissipation from a CPUchipset or processor to a heatsink
Excellent thermal impedance
Perfect stability - will not separaterunmigrateor bleed
Non capacitive or electrically conductive
Specificaties:
Net weight: 500 g (330 ml)
Dimensions: 49 (diameter) x 232 mm
Color: grey
Thermal conductivity: > 4.63 W / mK
Thermal Impedance <0.0087 ? C-in2 / W
Weight loss after 96 hours @ 100?C: <0.15 %
Permittivity @ 106 Hz: 2.4
Volume Resistivity: 5.0 x 10E13 (Ohm*cm)
Dielectric Strength: 2.5 KV/mm
Operating Temperature: -30 ~ 280 ? C
Density: > 3.15 g/ cm3
Volatility: <0.15 % @100?C
The dielectric constant: > 2.4
Dissipation Factor: <0.005
Viscosity: 12500 Pa s
Thixotropic index: 350 ? 10 1/10mm
Composites: 15% silicone compounds
Compounds: 35% of carbon
The compounds of metal oxides: 50%
Thermal silicone compound (grease) for heatsinks
Helps the heat dissipation from a CPUchipset or processor to a heatsink
Excellent thermal impedance
Perfect stability - will not separaterunmigrateor bleed
Non capacitive or electrically conductive
Specificaties:
Net weight: 500 g (330 ml)
Dimensions: 49 (diameter) x 232 mm
Color: grey
Thermal conductivity: > 4.63 W / mK
Thermal Impedance <0.0087 ? C-in2 / W
Weight loss after 96 hours @ 100?C: <0.15 %
Permittivity @ 106 Hz: 2.4
Volume Resistivity: 5.0 x 10E13 (Ohm*cm)
Dielectric Strength: 2.5 KV/mm
Operating Temperature: -30 ~ 280 ? C
Density: > 3.15 g/ cm3
Volatility: <0.15 % @100?C
The dielectric constant: > 2.4
Dissipation Factor: <0.005
Viscosity: 12500 Pa s
Thixotropic index: 350 ? 10 1/10mm
Composites: 15% silicone compounds
Compounds: 35% of carbon
The compounds of metal oxides: 50%
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