Kenmerken:
Thermal compund (grease) for heatsinks
Helps the heat dissipation from a CPUchipset or processor to a heatsink
Excellent thermal impedance
Perfect stability - will not separaterunmigrateor bleed
Non capacitive or electrically conductive
Specificaties:
Weight: 3.0 g
Color: gray
Thermal conductivity: > 4.5 W / mK
Thermal Impedance <0.205 ? C-in2 / W
Density: > 2.5
Evaporation: <0.001 %
Volatility: <0.005 %
The dielectric constant: > 5.1
Dissipation Factor: <0.005
Viscosity: 76 CPS
Thixotropic index: 310 ? 10 ? C
Operating Temperature: -50 ~ 240 ? C
Composites: 50% silicone compounds
Compounds: 30% of carbon
The compounds of metal oxides: 20%
Thermal compund (grease) for heatsinks
Helps the heat dissipation from a CPUchipset or processor to a heatsink
Excellent thermal impedance
Perfect stability - will not separaterunmigrateor bleed
Non capacitive or electrically conductive
Specificaties:
Weight: 3.0 g
Color: gray
Thermal conductivity: > 4.5 W / mK
Thermal Impedance <0.205 ? C-in2 / W
Density: > 2.5
Evaporation: <0.001 %
Volatility: <0.005 %
The dielectric constant: > 5.1
Dissipation Factor: <0.005
Viscosity: 76 CPS
Thixotropic index: 310 ? 10 ? C
Operating Temperature: -50 ~ 240 ? C
Composites: 50% silicone compounds
Compounds: 30% of carbon
The compounds of metal oxides: 20%
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